copper tin alloyplating for inhibitor ZM-51
copper tin alloyplating for inhibitor ZM-51
CAS:
Molecular Formula: CuSn
copper tin alloyplating for inhibitor ZM-51 - Names and Identifiers
| Name | copper tin alloyplating for inhibitor ZM-51 |
| Synonyms | copper tin alloyplating for inhibitor ZM-51 |
copper tin alloyplating for inhibitor ZM-51 - Physico-chemical Properties
| Molecular Formula | CuSn |
| Molar Mass | 182.256 |
| Physical and Chemical Properties | This product is light yellow transparent liquid, with good water-soluble, non-toxic, non-corrosion, chemical stability. |
copper tin alloyplating for inhibitor ZM-51 - Introduction
Copper-tin alloy fog inhibitor ZM-51 is a chemical product with the following properties:
Nature:
1. Appearance: colorless or yellowish liquid;
2. Main ingredients: containing active surfactant and fog inhibitor;
3. solubility: can be dissolved in water.
Use:
copper tin alloy fog inhibitor ZM-51 is mainly used in the electroplating industry in the copper tin alloy plating solution, used to inhibit the phenomenon of bubbles or fog. It can improve the surface tension of the liquid in the electroplating process, maintain good smoothness and wettability, thereby improving the stability of the plating solution and the quality of the copper-tin alloy coating.
Preparation Method:
The preparation of ZM-51 usually includes the following steps:
1. adding an appropriate amount of active surfactant and fog inhibitor into an appropriate amount of solvent;
2. Stir and mix at an appropriate temperature until a uniform liquid is obtained.
Safety Information:
When using the ZM-51, pay attention to the following safety matters:
1. avoid direct contact with skin and eyes, such as accidental contact, should immediately rinse with water and seek medical advice;
2. During use, a well-ventilated working environment should be maintained to avoid inhalation or swallowing;
3. should be stored to avoid high temperature and fire;
4. Read the product manual carefully before use, and use it in accordance with the correct method and dosage.
Nature:
1. Appearance: colorless or yellowish liquid;
2. Main ingredients: containing active surfactant and fog inhibitor;
3. solubility: can be dissolved in water.
Use:
copper tin alloy fog inhibitor ZM-51 is mainly used in the electroplating industry in the copper tin alloy plating solution, used to inhibit the phenomenon of bubbles or fog. It can improve the surface tension of the liquid in the electroplating process, maintain good smoothness and wettability, thereby improving the stability of the plating solution and the quality of the copper-tin alloy coating.
Preparation Method:
The preparation of ZM-51 usually includes the following steps:
1. adding an appropriate amount of active surfactant and fog inhibitor into an appropriate amount of solvent;
2. Stir and mix at an appropriate temperature until a uniform liquid is obtained.
Safety Information:
When using the ZM-51, pay attention to the following safety matters:
1. avoid direct contact with skin and eyes, such as accidental contact, should immediately rinse with water and seek medical advice;
2. During use, a well-ventilated working environment should be maintained to avoid inhalation or swallowing;
3. should be stored to avoid high temperature and fire;
4. Read the product manual carefully before use, and use it in accordance with the correct method and dosage.
Last Update：2024-04-09 15:17:33
